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                              Precision electronics
                              • Microelectronic semiconductor clean room design decoration

                              Microelectronic semiconductor clean room design decoration

                              The semiconductor unit space units are in microns, so the dust particles are attached to the wafer making the semiconductor components, which may affect the pattern of the precise wire layout on it, resulting in serious consequences of short circuit or open circuit. All semiconductor process equipment must be placed in a closed space where dust is allowed to enter, which is the reason for the semiconductor clean room.
                              • Case Introduction

                                The semiconductor unit space units are in microns, so the dust particles are attached to the wafer making the semiconductor components, which may affect the pattern of the precise wire layout on it, resulting in serious consequences of short circuit or open circuit. All semiconductor process equipment must be placed in a closed space where dust is allowed to enter, which is the reason for the semiconductor clean room.

                              半導體無塵車間


                              Cleanliness level
                              ISO grade

                              Airflow pattern

                              Average wind speed (m / s)

                              Air volume per unit aream3/m2.h

                              Applications

                              2

                              Unidirectional flow pattern

                              0.3-0.5

                              /

                              Lithography, semiconductor process area

                              3

                              Unidirectional flow pattern

                              0.3-0.5

                              /

                              Work area, semiconductor process area

                              4

                              Unidirectional flow pattern

                              0.3-0.5

                              /

                              Work area, multi-layer masking process, disk manufacturing semiconductor service area, power area

                              5

                              Unidirectional flow pattern

                              0.2-0.5

                              /

                              6

                              Non - unidirectional flow pattern

                              0.1-0.3

                              /

                              Power area, multi-layer process, semiconductor service area

                              Unidirectional flow pattern or Non - unidirectional flow pattern

                              /

                              70-160


                              7

                              Non - unidirectional flow pattern

                              /

                              30-70



                              Service area

                              Unidirectional flow pattern or Non - unidirectional flow pattern

                              /


                              8

                              Non - unidirectional flow pattern

                              /

                              10-20

                              Surface treatment

                              Unidirectional flow pattern or Non - unidirectional flow pattern

                              /



                              Microelectronics clean room Figure

                                Semiconductor clean clean workshop related to the use of technology and management methods:

                                1. Semiconductor clean clean room to ensure that the dust is only out of the inside, so clean and clean workshop to maintain greater than the atmosphere of the atmosphere. This requires the use of large blowers will be purified equipment, the air flow into the clean room.
                                2. To maintain constant temperature and humidity, large air-conditioning equipment to be used with the aforementioned blast pressure system. How long will the blower be pressurized and how long the air conditioner will take.
                                3. All the air flow direction of the purification equipment are mainly from top to bottom, therefore, clean and clean workshop interior space design or machine placement should avoid abrupt, so that dust bacteria and other clean and clean workshop in the opportunity to swing With time to a minimum.
                                4. All building materials are not easy to produce electrostatic adsorption of the main material.
                                5. Everyone or thing into the clean and clean workshop, people must wear matching dust clothing, people or things have to go through the air shower to blow the surface dust to get rid of the first.
                                6. The use of water in a clean, clean room is limited to deionized water. (Such as potassium, sodium ions) to pollute the gold-oxygen semi-transistor structure of the charged carrier channel, affecting the working characteristics of semiconductor components. Deionized water is the best solvent and detergent used in the semiconductor industry is extremely amazing!
                                7. Semiconductor clean and clean workshop All available gas sources, including blown wafers and machine air pressure required, have to use nitrogen (98%), blown wafers of nitrogen or even more than 99.8% Pure nitrogen.

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